Tag: chiplets

References Exploiting 2.5D/3D Heterogeneous Integration for AI Computing1 Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling2 End-to-End Benchmarking of Chiplet-Based In-Memory Computing3 Summary HISIM4, a modeling and benchmarking tool for heterogeneous integration of chiplets by communicating through NoP5. Components: partitioning, mapping and placement; computing unit/processing unit; heterogeneous interconnection; network/routing engine; thermal analysis. technology roadmap6, power/latency prediction,…